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Analytical Services

...for Microelectronics Failures

Delamination / CSAM Analysis

With our modern OKOS Scanning Acoustic Microscope (SAM) in B or C-mode (C-SAM), we can identify de-lamination within your package or bonded wafer.

If de-lamination is found; Sage Analytical Lab has exactly what you need to determine the specific location of observed de-lamination and potential roots cause.