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...for Microelectronics Failures

Copper / Stack Die Decapsulation

With the introduction of copper wire bonded ICs and stacked die, decapsulation has once again become a the challenge for failure analysis laboratories.

Standard methods compromise wire bond integrity and structure, which may alter findings.

At Sage Analytical we have overcome these challenges by utilizing one of the world’s best decapsulation systems: the JetEtch Pro automated decapsulation system.

Manufactured by Nisene Technology Group this tool is one of the most reliable decapsulating systems available. The unit has been redesigned for maximum efficiency, increased control and safety.

“The JetEtch Pro – CuProtect applies a bias to the solution being pumped to the sample in the process chamber. This bias creates a condition in which negatively-charged sulfate ions are attracted and temporarily bond to the surface of the copper wire while the sample is being etched. This temporary sulfate ion coating protects the copper wires from corrosion while the sample undergoes the etching process.” – Nisene Technology Group

This biased application process yields results that are unmatched in the industry. The JetEtch Pro decapsulation system can safely etch virtually any sample put into its etch chamber. This flexible system can be fine-tuned for the most complex package designs including samples with gold, aluminum, and copper wires.