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Analytical Services

...for Microelectronics Failures

CSAM Evaluation

With our modern OKOS Scanning Acoustic Microscope (SAM) in B or C-mode (CSAM), we can non-destructively image the delamination within your package or bonded wafer.

Once the area of interest has been identified, we are able to cross section mechanically or with Dual-Beam Focused Ion Beam (FIB) to determine the precise details of observed de-lamination.

Sage has a full complement of SAM transducers from the low frequency range to high frequency to support your needs. Whether you need SAM top scans with high spatial resolution or thru scans with a high degree of sample penetration, Sage has the transducer you need to get the job done.