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Analytical Services

...for Microelectronics Failures

Package Integrity Evaluation

Modern packaging processes are often as complex as the die themselves.

Using the extensive packaging analysis tools available at Sage Analytical Laboratories even the most subtle of packaging issues and analyses may be performed.

Tools that may be used include:

  • Sub-micro resolution 3D x-ray tomography
  • Scanning Acoustic Microscopy (SAM)
  • Time Domain Reflectometry (TDR)
                          • Mechanical cross sections
                          • FIB cross sections
                            • Elemental mapping (EDS/EDX)

    We are equipped to handle parts which are wire bonded, flip-chip, or surface mount on any substrates.

    Common fail analyses include:

              • Contact non-wets
              • BGA voiding
              • BGA separation
              • Underfill voids
              • Wire bond ball and wedge analysis (non-destructive)
              • C4/bump integrity
              • C4/bump shape
              • Laminate and board trace evaluation
              • Die cracking
              • Many other forms of packaging inspection

    Whether it is a constructional analysis or an in-depth packaging failure analysis that is needed, we are equipped with the personnel and tools to handle your request with efficiency and quality.